Reinforced Glass
Explore our primary portfolio of polyimide films, specialized fiberglass, and shielding tapes engineered for relentless thermal, mechanical, and dielectric endurance under extreme environments.
Reinforced Glass
PCB Insulation
Kapton Equivalent
Heavy Packaging
EMI Shielding
Waterproof Nano
PTFE Heat Sealing
Thermal Masking
Operated by Zhuhai Huayuan Electronics Co., Ltd., our dual industrial sites house 6 multi-roller micro-gravure coating lines, automated slitting facilities, and ISO Class 1,000 dust-free cleanrooms designed specifically for sensitive optical and electronic masking grades.
Certified under ISO 9001 since 2013, our production logs batch-level chemical compositions, coating dry-weights, and cross-directional tensile elongation metrics. Every master log roll receives comprehensive FTIR spectrometry testing to ensure total absence of plasticizer migration.
From micro-dots (Ø 1.5mm) for high-density BGA soldering pads to custom laser-cut sheets with split release liners for EV battery bussing strips, we provide engineering converters with custom slit widths (from 2mm to 1000mm) and high-speed rotary die-cut components.
Polyimide masking tape (frequently referred to in international procurement under the legacy brand name Kapton tape) represents one of the most critical auxiliary consumables in modern advanced electronics manufacturing. Synthesized from aromatic dianhydrides and aromatic diamines, polyimide (PI) films possess an aromatic heterocyclic molecular spine that delivers an unparalleled combination of thermal stability, chemical inertness, high mechanical strength, and exceptional dielectric withstand voltage.
Historically utilized within aerospace wiring harnesses and heavy Class H transformer coils, polyimide film coated with high-performance pressure-sensitive adhesives (PSA) has transformed into an indispensable barrier material across High-Density Interconnect (HDI) PCBs, Surface-Mount Technology (SMT) reflow profiling, semiconductor wafer dicing, and automotive Lithium-ion (LIB) energy storage systems. The rapid proliferation of lead-free soldering processes—mandated by RoHS and WEEE directives—has escalated peak reflow chamber temperatures from 215°C up to 260°C–280°C. Under these ferocious processing conditions, conventional polyester (PET) or paper masking substrates fail cataclysmically through carbonization, melting, or adhesive transfer. Polyimide remains the preeminent material capable of maintaining dimensional integrity and peeling cleanly with zero ionic or chemical residue.
As enterprise procurement directors and supply-chain quality managers reassess their vendor portfolios, three profound macro-technological transformations are reshaping the wholesale polyimide masking tape landscape:
With semiconductor packaging adopting chiplet designs, fan-out wafer-level packaging (FOWLP), and ultra-fine pitch ball-grid arrays (BGAs), masking tapes must eliminate electrostatic discharge (ESD) hazards. Standard polyimide unwinding generates triboelectric surface charges exceeding 3,000 to 5,000 Volts, sufficient to cause micro-dielectric breakdown on sub-3nm silicon nodes. The global market is transitioning rapidly toward anti-static ESD-treated polyimide masking tapes whose outer surface or adhesive matrix exhibits a surface resistivity of 106 to 109 Ω/sq, limiting peel-off voltage to under 50V.
Electric vehicle (EV) battery packs are migrating from 400V to 800V silicon-carbide (SiC) fast-charging platforms. This transition mandates insulation materials with higher comparative tracking index (CTI Group I) ratings and breakdown voltages exceeding 6.0 kV per mil. Furthermore, within prismatic and cylindrical pouch cells, polyimide tapes must offer complete chemical inertness against aggressive organic carbonate solvent electrolytes containing LiPF6 (lithium hexafluorophosphate) salts. Conventional adhesives degrade and liberate plasticizers that cause catastrophic battery impedance spikes; specialized electrolyte-resistant crosslinked acrylate and fluorosilicone polyimide tapes have thus emerged as a mandatory tier-1 specification.
Silicone migration poses an acute hazard in optical sensor bonding, camera module assembly, and automotive paint shops. Airborne or contact volatile silicone molecules (D4–D10 siloxanes) cause dewetting, catastrophic wire-bonding failures, and optical lens hazing. In response to rigorous procurement audits from leading automotive OEM and display manufacturers, Huayuan has engineered non-silicone acrylic-adhesive polyimide masking tapes that achieve 180°C continuous resistance without employing any dimethylsiloxane polymers.
The table below provides direct engineering benchmark metrics comparing standard commercial polyimide grades, ESD anti-static formulations, and specialized battery insulation tapes produced at our Zhuhai and Zhongshan factories.
| Technical Parameter | Standard PI Masking Tape | ESD Low-Static PI Tape | Non-Silicone Acrylic PI | EV Battery Grade PI | Test Standard |
|---|---|---|---|---|---|
| Backing Film Thickness | 25 µm (1.0 mil) | 25 µm (1.0 mil) | 25 µm (1.0 mil) | 25 µm / 50 µm | ASTM D3652 |
| Total Finished Thickness | 60 µm ± 3 µm | 60 µm ± 3 µm | 55 µm ± 3 µm | 65 µm / 90 µm | ASTM D3652 |
| Adhesive Chemistry | Cured Polysiloxane | ESD Silicone Hybrid | High-Temp Pure Acrylic | Electrolyte Acrylate | FTIR Standard |
| Adhesion to Stainless Steel | 6.0 ± 1.0 N/25mm | 5.5 ± 1.0 N/25mm | 6.5 ± 1.2 N/25mm | 7.0 ± 1.0 N/25mm | ASTM D3330 |
| Tensile Strength | ≥ 135 N/25mm | ≥ 135 N/25mm | ≥ 140 N/25mm | ≥ 210 N/25mm | ASTM D3759 |
| Elongation at Break | 55% – 70% | 50% – 65% | 50% – 60% | 60% – 85% | ASTM D3759 |
| Dielectric Breakdown Voltage | ≥ 6.5 kV | ≥ 6.0 kV | ≥ 6.0 kV | ≥ 8.5 kV | ASTM D149 |
| Temperature Resistance (Peak) | 260°C (30 min) / 300°C (10s) | 260°C (30 min) | 180°C (Continuous) | 200°C (1 hr) | UL 510 |
| Surface Resistivity (Backing) | Insulative (>1012 Ω/sq) | 106 – 109 Ω/sq | Insulative | Insulative | ASTM D257 |
| Peel Triboelectric Voltage | > 2,500 Volts | < 50 Volts | > 1,800 Volts | > 2,000 Volts | Static Meter |
| Clean Removal / Residue | Zero Ghost Residue | Zero Ghost Residue | Zero Residue | Electrolyte Permanent | Microscope 100x |
How our polyimide masking and double-sided bonding configurations solve process bottlenecks across critical global industries.
During molten solder immersion and convective reflow soldering, PCB edge contacts (gold fingers) and through-hole test pads must be shielded from solder splash and dross deposition. Huayuan Polyimide Masking Tapes utilize a custom high-crosslink silicone polymer that withstands direct contact with liquid solder at 260°C to 280°C. Upon line exit and cooling, the tape strips cleanly in single-piece fashion without tearing or shedding tacky siloxane residues, eliminating costly manual solvent cleaning cycles.
In high-capacity prismatic cells and 4680 cylindrical formats, polyimide tape serves as critical tab-insulation, core wrapping, and pouch-edge protection. Our electrolyte-resistant formulations are chemically evaluated through 30-day immersion in dynamic LiPF6 organic solvents at 60°C. The backing film demonstrates zero dissolution, pinhole creation, or delamination, preventing catastrophic internal micro-short circuits while supplying high breakdown voltage across intense vibration profiles.
Within cleanroom semiconductor processing, our ultra-flat polyimide tapes serve as temporary carrier substrates during thin wafer back-grinding and thermocompression die-attach sequences. Precision optical-grade transparency permits automatic vision system alignment, while low total mass loss (TML < 0.8%) and collected volatile condensable material (CVCM < 0.05%) under ASTM E595 vacuum outgassing standards guarantee the preservation of vacuum sputtering chambers.
Subjected to extreme thermal swings (-73°C to +260°C) and cosmic ultraviolet irradiation, aerospace wiring harnesses depend on polyimide film tapes for spiral wrapping and junction potting. Meeting UL-94 V-0 flame-retardancy standards, our polyimide self-extinguishes within seconds without releasing halogenated toxic gases, ensuring compliance with strict civil aviation safety guidelines.
Industrial FDM and SLA 3D printers producing components from engineering resins (such as ABS, PEEK, and Ultem) require heated bed surfaces that prevent thermal contraction and warping. Broad-width polyimide rolls (up to 500mm wide) provide an exceptionally smooth, heat-conductive platform that forms strong mechanical bonds with hot extruded plastics, yet easily releases finished parts when cool.
High-voltage traction motors used in high-speed rail and wind turbine generators generate tremendous electromagnetic induction and thermal stress. Huayuan polyimide tapes and glass cloth composites provide interlayer barrier insulation, slot cell lining, and lead wire anchoring, retaining mechanical elasticity under continuous 180°C (Class H) operating ratings without dielectric degradation.
For strategic sourcing directors at Fortune 500 electronics manufacturing services (EMS) providers, securing polyimide masking tape involves significantly more than competitive wholesale roll pricing. Quality risk mitigation demands stringent factory auditing across four critical axes:
A variation of merely ±2 micrometers in adhesive coating thickness across a 1040mm master web can cause catastrophic variations in peel adhesion, resulting in either tape lifting during wave soldering or adhesive residue during high-speed stripping. At our Zhuhai production headquarters, online infrared beta-gauge thickness monitors continuously track wet-and-dry coating mass across 128 transverse scanning points. Our statistical process control delivers a process capability index (Cpk) consistently exceeding 1.67, ensuring identical peel performance from roll-to-roll and year-to-year.
Every commercial production batch is accompanied by comprehensive, verifiable documentation ready for immediate customer auditing:
Full compliance with EU Directive 2011/65/EU and Regulation (EC) No 1907/2006, tested annually by SGS for heavy metals and phthalates.
Certified under Underwriters Laboratories file standards (UL 510) for flame retardancy, insulation resistance, and dielectric tracking.
Tested under IEC 61249-2-21 standards (Chlorine < 900ppm, Bromine < 900ppm, Total Halogens < 1500ppm) for green electronics.
To eliminate geopolitical and localized supply-chain vulnerabilities, Huayuan maintains manufacturing and warehousing capabilities across two distinct facilities: our primary Nanping Science & Technology Park base in Zhuhai, and our newly inaugurated Tanzhou factory in Zhongshan, complemented by our Hong Kong international trade and financial settlement entity (Huayuan International Technology Hong Kong Co., Ltd.). This multi-site network guarantees rapid export clearances via Hong Kong, Shenzhen, and Guangzhou ports, offering 24-hour rapid sample preparation and guaranteed 14-day container fulfillment schedules.
Our ongoing R&D initiatives focus on boundary-pushing polymer engineering designed to solve next-decade thermal dissipation, packaging density, and ecological sustainability demands.
Developing 12.5 micrometer ultra-thin PI film tapes for space-constrained foldable OLED displays and micro-SMD masking, reducing overall stack thickness while maintaining 4.5kV dielectric performance.
Synthesizing high-temperature, PFAS-free acrylic adhesives capable of continuous 200°C operation, actively anticipating upcoming European environmental bans on poly- and perfluoroalkyl substances.
Incorporating sub-micron boron nitride (BN) and spherical aluminum oxide ceramic particles into the polyimide matrix to achieve bulk thermal conductivity > 1.2 W/m·K while safeguarding electrical isolation.
Collaborating with top Chinese chemical polymer universities to synthesize bio-derived diamine monomers, providing enterprise buyers with carbon-neutral polyimide films possessing circular closed-loop recyclability.
Direct, unambiguous answers to the most common questions raised during vendor qualification, sample testing, and contract manufacturing negotiations.
Explore our expanded range of specialized battery insulation, conductive fabric EMI shielding, copper foils, and structural double-sided adhesives.
EV Battery Tab
Conductive Fabric
Waterproof Gel
Copper Foil
3M 69 Equivalent
Powder Coating
EMI Protection
High Durability
Validate Huayuan polyimide masking tapes under actual factory SMT reflow, wave soldering, or battery assembly trials. Tell us your substrate, process temperature, and custom slitting dimensions to receive free sample lots within 24 hours.