| Product Name | Model No | Carrier | Thickness (mm) | Heat Resistance (℃) | Tensile Strength | Equivalent |
|---|---|---|---|---|---|---|
| Fiberglass Tape | HY430-1 | Fiber glass | 0.17 | -20～80 | 800 | 3M898 |
| HY430-2 | Mesh polyester fiber | 0.20 | 850 | - | ||
| HY430-3 | Polyester fiber | 0.17 | 750 | - | ||
| HY430-4 | Double-sided | 0.18 | 850 | - | ||
| HY430-5 | Non-residual glass fiber | 0.14 | -10~80 | 850 | - | |
| HY430-6 | Residual glass fiber | 0.15 | -5~70 | 850 | - |
Glass fiber adhesive tape is soft, easy to stretch and good to fit, which is very suitable for bundling, branch fixing and temporary fixing of wire harness.
It is often used to arrange and fix the internal wiring harness of household appliances, automotive wiring harness and internal connecting wires of electronic equipment.
Due to the light and thin material, fiberglass tape is suitable for insulation scenes sensitive to thickness, such as:
In the manufacture of lithium batteries, glass fiber tape is often used for:
Its thin and light characteristics will not increase the extra thickness of the battery cell, and it is suitable for designs with high space requirements.
Glass fiber tape can be used in SMT and PCB processes:
Fiberglass tape is made of high-strength glass fiber cloth as the carrier, coated with high-temperature resistant silica gel or acrylic adhesive. Different models may use mesh polyester fiber, polyester fiber, or double-sided carriers to meet various application requirements.
Most fiberglass tape models (HY430-1 to HY430-4) offer a heat resistance range of -20℃ to 80℃. The HY430-5 model supports -10℃ to 80℃, while HY430-6 is rated for -5℃ to 70℃. Please refer to the product specifications table for the exact model that fits your application.
Yes. Fiberglass tape is widely used in lithium battery manufacturing for lightweight surface wrapping of battery cores, temporary fixation between battery cores and protective plates, and bundling of wire harnesses inside battery modules. Its thin and light characteristics make it ideal for space-constrained battery designs.
Yes. Fiberglass tape is commonly used in SMT and PCB processes for temporarily fixing flexible circuit boards (FPC), masking areas that do not require soldering or coating, and providing temporary protection during various stages of the manufacturing process.
Non-residual glass fiber tape (HY430-5) is designed to leave no adhesive residue upon removal, making it ideal for applications where surface cleanliness is critical. Residual glass fiber tape (HY430-6) may leave some adhesive trace after removal and is suited for applications where permanent or semi-permanent bonding is acceptable.
The HY430-1 model is listed as equivalent to 3M898. It uses a fiberglass carrier, has a thickness of 0.17mm, a tensile strength of 800, and a heat resistance range of -20℃ to 80℃, making it a suitable alternative for applications that previously used 3M898 tape.
