| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | - |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | - | |
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | - | |
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2D | 0.025 | 0.06 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | - | |
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.05 | 0.08 | 6.0 | 20 | 55-65 | 260 | - | |
| HY200-3B | 0.05 | 0.10 | 6.5 | 20 | 55-65 | 260 | - | |
| HY200-4 | 0.075 | 0.12 | 6 | 28 | 60-65 | 260 | - | |
| HY200-5 | 0.10 | 0.15 | 6 | 36 | 70-75 | 260 | - | |
| HY200-6 | 0.125 | 0.18 | 6 | 40 | 80-85 | 260 | - | |
| HY200-2DA | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2DB | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 | - |
Serving as the primary sector for polyimide tape, matching the stringent requirements of high-density precision component fabrication and surface assembly.
Essential for edge-connector (gold finger) masking during electroplating and soldering processes. Leaves zero residual glue after detachment, guaranteeing surface integrity. Provides reliable localized heat-shielding during wave and reflow soldering operations.
Applied to resistors, capacitors, inductors, and IC chips for terminal pin shielding, short-circuit prevention, and flexible flat cable (FFC) bundling. Operates cleanly under elevated heat without outgassing.
Critical for pouch cells and cylindrical lithium cells. Applied to electrode tab wrapping, internal core insulation, and battery exterior protection with strong electrolyte corrosion defense.
Ensures high-integrity selective masking during industrial powder coating, baking, anodizing, and sandblasting. Strips cleanly without adhesive residue or substrate deformation.
Engineered to support extreme outdoor durability, thermal cycling tolerance, and high-voltage insulation in green technology products.
Protects solar cell arrays during series interconnection and high-temperature soldering. Withstands prolonged UV exposure and wide thermal fluctuation cycles across outdoor operational lifespans.
Integrates into EV drive motors and internal electronic controllers, providing durable dielectric barriers and mechanical wire wrapping under elevated ambient temperatures.
Acts as an internal barrier between battery cells and structural modules, preserving structural cohesion and insulation performance amid severe vehicle vibrations and thermal shifts.
Shields and seals fuel cell bipolar plates and membrane electrode assemblies, resisting hydrogen permeation and maintaining chemical stability during continuous operation.
A versatile masking solution for rigorous thermal processing lines and precision mechanical fabrication.
Protects non-target surfaces during high-temperature baking, electrophoresis, and electroplating. Also prevents tooling scratches and abrasion during metal stamping and bending.
Facilitates component hold-down and release masking during carbon fiber and engineering plastic thermosetting, peeling away cleanly without disrupting component surface profiles.
Covers non-cure regions across hardware, structural plastics, and coating layers subjected to high-temperature infrared or convection drying cycles.
Provides ultra-clean masking and lead frame protection during wafer processing, dicing, and packaging, ensuring micro-level particulate safety.
Supports interior harness insulation and assembly within diagnostic scanners and autoclaves, surviving repeated high-temperature sterilization processes.
Serves as a reliable polyimide base film for tracking labels exposed to sustained operational heat, such as automotive engine blocks and boiler housings.
Polyimide tape consists of a durable polyimide film carrier backed with high-performance silicone or acrylic adhesive. It is widely termed "Golden Finger Tape" because its primary industrial use is shielding the gold-plated contact fingers on PCBs during wave soldering and chemical baths to prevent oxidation and solder contamination.
The entire HY200 product series handles continuous working temperatures up to 260°C (500°F), allowing it to undergo lead-free reflow profiling, powder coat curing, and hot-air welding without thermal degradation.
No. Formulated with stable cross-linked silicone adhesive systems, the tape delivers clean, residue-free peeling even after direct exposure to high-temperature solder waves, keeping circuit contacts and metal finishes spotless.
Several models correspond directly to standard industrial grades: HY200-2B replaces 3M 98C-12, HY200-2D directly matches 3M 7413D, and HY200-2F serves as a functional replacement for 3M 98C-1, offering identical mechanical performance with superior cost advantages.
Yes. Roll slitting widths, carrier thicknesses (from 0.015mm to 0.125mm), and adhesion values can be tailored precisely to match unique industrial automated lines or custom die-cut designs.
Yes. The polyimide film provides exceptional barrier defense against lithium battery organic electrolytes, standard industrial solvents, flux, acids, and alkalis, making it ideal for cleanroom battery and chemical masking processes.
