Engineered for extreme thermal gradients, zero-residue masking, and dielectric performance in mission-critical applications.
Polyimide (PI) film adhesive tapes represent the technological pinnacle of polymeric dielectric insulation and continuous high-temperature chemical shielding.
The baseline thermal and mechanical resilience stems from the rigid aromatic backbone established during the polycondensation of aromatic diamines and dianhydrides. This molecular ring structure maintains absolute dimensional stability, low thermal shrinkage (<0.1% at 200°C), and prevents volatile outgassing during high-vacuum semiconductor and aerospace deployment.
Our formulation engineering offers dual adhesive compatibility: Crosslinked organopolysiloxane (silicone) adhesives achieve continuous operational resistance from -73°C to 260°C with clean, residue-free peeling on gold-plated PCB surfaces. Alternatively, pure modified acrylic formulations provide ultimate electrolyte resistance within lithium battery core packs.
Displaying extreme volume resistivity (>1016 Ω·cm) and dielectric strength upwards of 6.5 kV per 25μm film thickness, our polyimide substrates prevent micro-arcing in dense power transformer windings, high-voltage traction inverters, and Class H motor windings. They also provide natural UL94 V-0 flame retardance.
Operating dust-free coating and micro-slitting installations across Zhuhai and Zhongshan to safeguard dielectric purity and yield consistency.
Adhesive coating and web laminating take place in positively pressurized cleanrooms to eliminate airborne particle contamination, ensuring dielectric surfaces remain pinhole-free.
Non-contact beta-ray sensors track baseline film uniformity and dynamic wet adhesive spread in real time, locking coating weight variance within ±1.2 g/m² across entire jumbo logs.
Parallel processing lines across our Guangdong factories guarantee uninterrupted raw chemical procurement, scale advantages, rapid slitting, and continuous container loads during peak demands.
Every slit reel, master log, and die-cut sheet is cataloged via serialized QR lot codes, maintaining an unbroken manufacturing audit trail from synthetic polymer reactors to destination ports.
Translating material sciences into mission-critical performance across aerospace, automotive electrification, and high-frequency electronics.
Gold-finger contact protection during lead-free wave soldering, high-temp SMT reflow masking, and carrier stabilization during automated pick-and-place processing. Releases cleanly without adhesive ghosting or residue transfer at temperatures exceeding 260°C.
Specialized polyimide tapes built with electrolyte-inert pressure-sensitive adhesives protect electrode tabs, wrap core jelly rolls, and insulate busbars against mechanical puncture and chemical deterioration inside harsh LiPF6 electrolyte chemistries.
Lightweight wire harness bundling, radiation insulation shielding, and multilayer thermal insulation (MLI) blankets. Resistant to high-energy gamma radiation, atomic oxygen erosion, and cryo-thermal orbital temperature swings from -200°C to +260°C.
| Property Parameter | Standard Test Protocol | Standard PI Grade | Heavy-Duty / Low-Static Grade |
|---|---|---|---|
| Base Film Thickness | ASTM D3652 | 0.025 mm (1.0 mil) | 0.050 mm (2.0 mil) |
| Adhesive Layer Chemistry | FTIR Spectroscopy | Crosslinked Polysiloxane | ESD-Passivated Silicone |
| Total Tape Thickness | ASTM D3652 | 0.060 mm ± 0.005 mm | 0.090 mm ± 0.005 mm |
| 180° Peel Adhesion (Steel) | ASTM D3330 / PSTC-101 | ≥ 6.5 N / 25mm | ≥ 7.2 N / 25mm |
| Tensile Strength at Break | ASTM D3759 | ≥ 135 N / 25mm | ≥ 220 N / 25mm |
| Elongation Rate (%) | ASTM D3759 | ≥ 45 % | ≥ 60 % |
| Dielectric Breakdown Voltage | ASTM D149 | 6,500 Volts | 9,800 Volts |
| Continuous Temperature Endurance | UL 510 Thermal Index | -73°C to 260°C | -73°C to 280°C (Short Peak 300°C) |
| Flammability Rating | UL 94 | V-0 Flame Retardant | V-0 Flame Retardant |
Addressing the shifting demands of micro-electronics packaging, wide-bandgap (SiC/GaN) semiconductors, and sustainable supply chains.
As microelectronics shrink and 5G/6G RF components scale in density, our laboratory has developed 12.5μm and 7.5μm sub-gauge polyimide formulations coated with thin silicone films (sub-10μm), cutting thermal resistance while maintaining insulation safety margins.
Incorporating surface-modified boron nitride (BN) and aluminum oxide (Al2O3) nano-fillers into the polyimide precursor matrix elevates composite thermal conductivity from 0.16 W/m·K up to 1.2 W/m·K, solving localized hotspot bottlenecks in high-frequency SiC modules.
Accelerating environmental stewardship through 100% solids UV-cured silicone adhesives and fluorocarbon-free PET/polyimide liners. Our long-term R&D targets bio-derived dianhydride backbones to reduce lifecycle carbon footprints in green energy systems.
Built for Tier-1 supply chains: precision custom slitting, specialized rotary die-cutting, cleanroom packaging, and global logistics reliability.
Custom micro-widths from 2 mm to 1,000 mm with tolerance limits held to ±0.15 mm. Available in long-length traverse spool configurations for continuous, high-speed automated winding lines.
High-speed rotary and flatbed die-cutting for intricate geometric profiles, pre-cut solder masks, dot discs, and dual-tab release liners, allowing direct integration into robotic electronics manufacturing.
Complete custom branding options including branded plastic cores, specialized moisture-barrier individual shrink wraps, printed tear strips, and fully certified private-label master cartons.
Strategic logistics gateways via Shenzhen, Guangzhou, and Hong Kong ensure express air sample delivery in 3–5 business days and rapid ocean freight access for global port destinations.
Stringent third-party laboratory verification matching European, North American, and Asian import standards.
Tested under recognized industrial standards for component electrical insulation safety, certifying continuous operation at 180°C (Class H) and transient operational stability up to 260°C.
Annual SGS and Intertek third-party testing guarantees complete compliance with EU 2015/863 (RoHS 2.0), SVHC candidate substances under REACH, and strict low-halogen manufacturing protocols (<900 ppm).
Our dedicated bilingual (English & Mandarin) technical support teams deliver substrate matching recommendations, thermal-mechanical stress simulation assessments, and full TDS/MSDS packs within 24 hours.
In-depth answers addressing thermal mechanics, adhesion chemistries, order logistics, and sample qualification.
Polyimide tape provides exceptional thermal stability (continuous 260°C with short peaks at 300°C) alongside high dielectric breakdown strength in thin profiles (1 mil / 25μm). PET polyester tapes are limited to Class B (130°C) or Class F (155°C) environments, making them cost-effective for general transformers. Fiberglass cloth tapes offer higher mechanical abrasion and tear resistance, but are substantially thicker (120μm–180μm) and lack the submicron dielectric uniformity required for modern precision microelectronics.
No. Our polyimide tapes use crosslinked, solvent-free polysiloxane silicone adhesives formulated specifically for zero adhesive transfer. They are tested under thermal profile simulations exceeding 260°C for 5 minutes (standard wave solder and reflow protocols), releasing smoothly and cleanly without requiring secondary solvent cleaning.
Equipped with imported automated slitting machinery, we hold width tolerances within ±0.15 mm across slit rolls ranging from 2 mm to 1,000 mm. For automated wire winding and coil production, we supply continuous traverse traverse-wound spools up to 3,000 meters in length. For electronic assembly lines, we provide kiss-cut and through-cut rotary die-cut geometries on transparent polyester release liners.
We produce our rolls within Class 1,000 and 10,000 cleanrooms using online radiometric beta-gauges to maintain coat weight precision within ±1.2 g/m². For high-speed unwinding in sensitive electronics environments, we supply our Anti-Static ESD Polyimide Tape, treated with proprietary organic antistatic surface layers on both the backing and release side to keep unwind static discharge under 100V (ASTM D257).
We provide complimentary qualification samples in custom widths for engineering testing. Standard evaluation rolls ship within 24–48 hours of initial review, accompanied by complete batch-specific Technical Data Sheets (TDS), safety documentation (MSDS/SDS), and relevant UL/RoHS compliance files.
Complete your supply chain qualification with our industrial double-sided, electromagnetic shielding, and specialty composite tapes.
