| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | ||
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | ||
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2D | 0.025 | 0.06 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | ||
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.05 | 0.08 | 6.0 | 20 | 55-65 | 260 | ||
| HY200-3B | 0.05 | 0.10 | 6.5 | 20 | 55-65 | 260 | ||
| HY200-4 | 0.075 | 0.12 | 6 | 28 | 60-65 | 260 | ||
| HY200-5 | 0.10 | 0.15 | 6 | 36 | 70-75 | 260 | ||
| HY200-6 | 0.125 | 0.18 | 6 | 40 | 80-85 | 260 | ||
| HY200-2DA | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2DB | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 |
Polyimide tape (often called Golden Finger Tape) is the core category of special adhesive products, with high temperature resistance, acid and alkali resistance and strong insulation, which is suitable for high-end manufacturing scenes and meets the high requirements of special adhesives. Its uses cover many core fields such as electronics and new energy. The specific categories are as follows:
This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.
Core use for gold finger protection. After the plug-in end (gold finger) is plated with gold/tin, tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue — easily peeled off. Also used for local shielding during wave soldering and reflow soldering.
Adapts to resistors, capacitors, inductors and chips for pin insulation and solder joint shielding to avoid short circuits. Fixes flat cables and wire harnesses — resistant to high temperature without releasing harmful substances.
Used for battery lug insulation and battery wrapping/fixing in soft-package and cylindrical lithium battery processing. Withstands high-temperature packaging processes and resists electrolyte corrosion for battery safety and stability.
Shields and protects parts that do not need treatment during spraying, baking and sandblasting. Withstands high temperature with no residual glue and no damage to the substrate after removal.
Meets the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapts to the manufacture of high-end new energy products.
Used for shielding protection when photovoltaic cells are welded in series. Resistant to high-temperature welding, UV rays and high-low temperature cycles for long-term outdoor use. Also assists with insulation and sealing of assembly frames and junction boxes.
Used in on-board motors and electronic control systems for line insulation and high-component protection.
Inside the power battery pack, used for insulation and isolation between batteries and modules. Withstands high/low temperature and vibration environments during vehicle operation.
Used for shielding and insulation in high-temperature processes when core components of fuel cells are processed. Withstands hydrogen environment corrosion to ensure equipment stability.
Suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.
Used for shielding and protecting non-processed surfaces during high-temperature spraying, electrophoresis and electroplating. Withstands high temperature without reacting with metal substrates. Also used for surface protection during metal stamping and bending to prevent scratching.
Used for mold shielding and product positioning when high-temperature resistant plastics and carbon fiber composites are molded. Withstands high molding temperatures with no residual glue after peeling, ensuring surface smoothness.
Covers parts that don't need curing during high-temperature baking and curing of various products (hardware, plastics, coatings). Withstands high temperatures and adapts to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes. Withstands high packaging temperatures with high cleanliness and no dust pollution.
Used in high-end medical instruments (high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components. Withstands high-temperature sterilization and meets medical-grade environmental standards.
Some polyimide tapes serve as high-temperature resistant label substrates for labels that need to be maintained in high-temperature environments for long periods (e.g., engine and boiler parts).
⭐ Core Characteristics Support: Wide temperature range, excellent insulation, acid & alkali resistance / salt fog / UV resistance, peeling without residual glue — benchmarking international similar high-end products.
🔧 Customized Adaptation: Products with different thickness, viscosity and temperature resistance can be customized according to the needs of different industries to adapt to different processes and scenarios — with cost advantages and higher cost performance than international brands.
