| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | - |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | - | |
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | - | |
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2D | 0.025 | 0.060 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | - | |
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.050 | 0.080 | 6.0 | 20 | 55-65 | 260 | - | |
| HY200-3B | 0.050 | 0.100 | 6.5 | 20 | 55-65 | 260 | - | |
| HY200-4 | 0.075 | 0.120 | 6.0 | 28 | 60-65 | 260 | - | |
| HY200-5 | 0.100 | 0.150 | 6.0 | 36 | 70-75 | 260 | - | |
| HY200-6 | 0.125 | 0.180 | 6.0 | 40 | 80-85 | 260 | - | |
| HY200-2DA | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2DB | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - |
The core is used for gold finger protection. After the plug-in end (gold finger) of the circuit board is plated with gold/tin, adhesive tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue can be easily peeled off, which is necessary for PCB process. At the same time, it can be used for local shielding protection during wave soldering and reflow soldering of circuit boards.
Adapts to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. It can also fix electronic flat cables and wire harnesses, which is resistant to high temperature and does not release harmful substances, suitable for internal wiring of high-end electronic equipment.
In the processing of soft-package lithium batteries and cylindrical lithium batteries, it is used for battery lug insulation and battery wrapping and fixing, which can withstand the high-temperature process when battery is packaged, and has the characteristics of electrolyte corrosion resistance to ensure the safety and stability of batteries.
When spraying, baking and sandblasting electronic components, it is used to shield and protect the parts that do not need to be treated. It can withstand high temperature, and there is no residual glue and no damage to the substrate after shielding.
Used for shielding protection when photovoltaic cells are welded in series, resistant to high-temperature welding process, ultraviolet rays and high-low temperature cycles, so as to meet the long-term use requirements of outdoor photovoltaic modules. It can also be used for insulation and sealing assistance of assembly frame and junction box.
Used in on-board motors and electronic control systems for line insulation and high-performance components. Inside the power battery pack, it is used for insulation and isolation between batteries and modules, and can withstand the high and low temperature and vibration environment when the car is driving.
Used for shielding and insulation in high-temperature process when the core components of fuel cell are processed, which can withstand the corrosion of hydrogen environment and ensure the stability of the equipment.
When metal parts are sprayed, electrophoresed and electroplated at high temperature, they are used for shielding and protecting the non-processed surfaces, which can withstand high temperature and do not react with metal substrates. It can also be used for surface protection of metal stamping and bending to prevent scratching.
When high-temperature resistant plastics and carbon fiber composite materials are molded, they are used for mold shielding and product positioning. Can withstand high molding temperature, and there is no residual glue after peeling to ensure the surface smoothness of products.
Used to cover the parts that don't need curing in the high-temperature baking and curing process of various products (such as hardware, plastics and coatings), and can withstand the high temperature and adapt to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes, which can withstand high packaging temperature and has high cleanliness without dust pollution.
Used in high-end medical instruments (such as high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components, which can withstand high-temperature sterilization process and meet medical-grade environmental protection standards.
Some polyimide tapes can be used as high-temperature resistant label substrate for labels that need to be kept in high-temperature environment for a long time (such as engine and boiler parts).
