Discover our primary conversion grades engineered with ultra-thin dielectric carriers, rigorous dimensional tolerance, and zero-residue adhesive chemistry for mission-critical industrial packaging.
Double Sided Polyimide Tape (commonly referenced alongside DuPont Kapton® equivalents) represents the pinnacle of micro-bonding performance in extreme thermal, mechanical, and electrical environments.
Polyimide polymers synthesized via the polycondensation of aromatic dianhydrides (such as PMDA) and diamines (such as ODA) yield rigid planar imide rings. This molecular architecture guarantees mechanical resistance from cryogenic lows of -269°C (-452°F) to continuous operational highs exceeding +260°C (+500°F), with momentary excursion endurance reaching +350°C during lead-free reflow.
While single-sided tapes offer surface masking, double-sided variants bridge dissimilar substrates. Huayuan formulates high-crosslinked polysiloxane systems on both faces, or dual-differential configurations (e.g., thermosetting solvent acrylic on Side A for immediate aggressive tack, and ultra-high-temp crosslinked silicone on Side B for residue-free release after exposure to aggressive molten flux).
Modern microelectronics require low dielectric constants (<3.5 at 1 MHz) alongside rigorous breakdown voltages (>6.5 kV/mil). Double-sided polyimide substrates act as active electrical insulating barriers, preventing galvanic corrosion, arcing, and leakage current migration within densely packed 5G radar modules and lithium battery power buses.
Procurement departments evaluate adhesive tapes by rigorous material metrics rather than marketing claims. The table below represents certified Huayuan factory lab parameters tested under ASTM and ISO standardized protocols.
| Property Parameter | Standard Polyimide Carrier | Ultra-Thin Micro Carrier | Heavy-Duty Dielectric Carrier | Test Standard |
|---|---|---|---|---|
| Base Film Thickness | 25 μm (1.0 mil) | 12.5 μm (0.5 mil) | 50 μm (2.0 mil) | ASTM D374 |
| Adhesive Type (Side A / Side B) | Crosslinked Silicone / Silicone | Thermoset Acrylic / Silicone | Solvent High-Shear Silicone | Spectroscopic Analysis |
| Total Caliper Thickness | 0.090 mm ± 0.005 mm | 0.045 mm ± 0.003 mm | 0.160 mm ± 0.008 mm | Micrometer Direct Contact |
| 180° Peel Adhesion (SUS Plate) | 6.5 ~ 9.0 N / 25mm | 5.0 ~ 7.5 N / 25mm | 8.5 ~ 12.0 N / 25mm | ASTM D3330 / PSTC-101 |
| Continuous Thermal Rating | -40°C to +260°C | -20°C to +220°C | -50°C to +280°C | UL 746B Thermal Index |
| Peak Excursion (Short Term) | +300°C (60s Solder Reflow) | +260°C (30s) | +350°C (120s Wave Solder) | IPC-TM-650 |
| Dielectric Breakdown Voltage | ≥ 6.5 kV | ≥ 4.2 kV | ≥ 11.0 kV | ASTM D149 (500V/sec) |
| Insulation Resistance | > 1.0 × 106 MΩ | > 1.0 × 106 MΩ | > 1.0 × 107 MΩ | ASTM D257 |
| Outgassing (CVCM / TML) | < 0.1% CVCM / < 1% TML | Aerospace Grade Compliant | < 0.05% CVCM / < 0.8% TML | ASTM E595 Cleanroom |
| Flame Retardancy | UL 94 V-0 Classified | UL 94 V-0 Classified | UL 94 V-0 Classified | UL 94 Flammability |
From new energy battery architecture to micro-die-cut semiconductor fabrication, our dual-coated polyimide solutions provide structural cohesion, thermal dissipation pathways, and lifetime electrical insulation.
In prismatic and cylindrical lithium battery packs, thermal runaway barriers require materials that do not ignite, shrink, or release conductive particulates. Double-sided polyimide tape provides structural bonding between aerogel insulation pads and liquid cooling cold plates, withstanding high electrolyte vapor concentrations without adhesive plasticization.
During the SMT assembly of multi-layer flex circuits in smartphones, medical endoscopy, and avionics instrumentation, rigid polyimide or stainless steel stiffeners must be permanently bonded prior to passing through wave soldering ovens. Our double-coated tapes guarantee zero bubbling and precise dimensional stability down to ±0.05 mm.
For BGA, CSP, and lead-frame carrier bonding, double-sided polyimide tapes act as temporary and permanent fixturing mediums. Designed with low ionic halogen contaminants (<50 ppm chlorides/fluorides), they eliminate risks of intermetallic corrosion on copper wire bonds and aluminum metallization layers under high operating temperatures.
Operating with twin production bases in Zhuhai and Zhongshan alongside a dedicated Hong Kong entity for international cross-border settlements, Huayuan delivers frictionless global supply chain integration.
Custom slitting widths (from 2 mm to 1000 mm), differential liner selections (fluorosilicone PET or glassine), and technical datasheets dispatched within 24 hours of technical inquiry.
ISO 9001:2015 certified workshops. Full lot-traceability for raw films and crosslinkers. SGS third-party reports, UL 94 V-0 flame ratings, and RoHS/REACH SVHC declarations furnished for every shipment.
Advanced rotary and flatbed die-cutting capabilities developed since 2013. We deliver kiss-cut parts on roll format with pull tabs for automated SMT tape-and-reel pick-and-place equipment.
Centrally located in the Greater Bay Area with immediate access to Hong Kong, Shenzhen, and Guangzhou ports, ensuring streamlined DDP, FOB, and CIF delivery to North America, Europe, and ASEAN manufacturing hubs.
As electronic packages shrink and power densities expand, conventional adhesive tapes must incorporate multi-physics capabilities. Here is how Huayuan is engineering the future of high-temperature double-sided bonding.
Infusing sub-micron hexagonal Boron Nitride (h-BN) and aluminum oxide into the dual silicone layers to achieve thermal conductivities exceeding 1.2 W/m·K while strictly preserving dielectric breakdown integrity above 5.0 kV.
Developing 7.5 μm polyimide base films coated on both sides with 10 μm micro-thin silicone layers. Designed for foldable OLED displays and ultra-compact wearable devices where stack height is heavily restricted.
Formulating high-temp dual-sided adhesives that exhibit aggressive peel strength (>10 N/25mm) through 260°C reflow, yet rapidly decouple to <0.5 N/25mm upon post-process UV irradiation for zero-damage component rework.
Migrating coating operations to 100% solids, UV-curable and hot-melt silicone formulations. This technological shift eliminates VOC greenhouse emissions and reduces embodied lifecycle energy consumption by over 42%.
Detailed answers to critical technical questions commonly evaluated during supplier audits, new product introduction (NPI), and quality validation.
Single-sided polyimide tape consists of a single layer of polyimide film (typically 25μm) coated on one face with pressure-sensitive silicone or acrylic adhesive, backed by a release liner (or self-wound). Double-sided polyimide tape features adhesive coatings on both the front and reverse surfaces of the core carrier film, protected by differential release liners (such as fluorosilicone-coated polyester on one side and a textured release film on the other). This facilitates permanent or temporary joining of two high-temperature surfaces while preserving dielectric isolation.
Silicone adhesives offer superior temperature thresholds (-40°C to +260°C continuous, +300°C peak), clean peel characteristics with zero silicone oil ghosting or residue on precious metals like gold and copper, and exceptional chemical inertness against wave-solder flux and chemical strippers. In contrast, acrylic adhesive variants provide higher room-temperature sheer and tensile holding strength, lower material cost, and zero risk of silicone outgassing in optics and hermetically sealed relay enclosures, but max out at continuous temperatures around +155°C to +180°C.
Yes. We specialize in differential adhesive formulations. For example, we frequently manufacture custom rolls featuring high-tack permanent acrylic adhesive on Side A (designed for bonding to FR4 stiffeners or aluminum heat spreaders) and clean-removable high-temperature silicone on Side B (designed for temporary fixturing during reflow cycles). Differential liner release forces ensure automated unwind equipment can remove the initial liner smoothly without delaminating the adhesive from the core carrier.
Our advanced vacuum-degassed polyimide tape series complies with NASA and ESA space-simulation outgassing criteria per ASTM E595, maintaining Total Mass Loss (TML) below 1.0% and Collected Volatile Condensable Material (CVCM) under 0.1%. Furthermore, production in Class 1,000 cleanroom environments prevents airborne particulates, silicone voids, and static charges, ensuring high yields in semiconductor and optical sensor mounting.
Free standard prototype sample rolls and die-cut sheet coupons are dispatched within 24 to 48 hours for qualification trials. Standard slitted roll production carries an MOQ of just 1 to 5 master logs depending on width, with normal lead times spanning 7 to 12 working days. Custom precision die-cut preforms involving custom hard tooling or laser prototypes can be produced and sampled in 3 to 5 business days.
Every master roll is inspected through automated laser micrometer web gauging to guarantee coating uniformity within ±1.5 μm. Thermal curing tunnels utilize multi-zone PID controllers to crosslink adhesives thoroughly, eliminating unreacted low-molecular-weight oligomers that cause cold flow or edge bleed. Precision razor and circular shear slitting units prevent edge compression, guaranteeing clean unwind performance down to the core.
Engineered to complement your polyimide conversion requirements: exploring high-tack VHB structural foams, flexible PET substrates, conductive shields, and high-temp glass fabrics directly from our Guangdong factory floor.
Whether you require slit log rolls, jumbo reels, or precision kiss-cut preforms on specialized fluorosilicone release liners, our Zhuhai and Zhongshan engineering laboratories stand ready to support your production line. We provide complete Technical Data Sheets (TDS), Safety Data Sheets (SDS), and custom sample packages within 24 hours.
