| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | - |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | - | |
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | - | |
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2D | 0.025 | 0.060 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | - | |
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.050 | 0.080 | 6.0 | 20 | 55-65 | 260 | - | |
| HY200-3B | 0.050 | 0.100 | 6.5 | 20 | 55-65 | 260 | - | |
| HY200-4 | 0.075 | 0.120 | 6.0 | 28 | 60-65 | 260 | - | |
| HY200-5 | 0.100 | 0.150 | 6.0 | 36 | 70-75 | 260 | - | |
| HY200-6 | 0.125 | 0.180 | 6.0 | 40 | 80-85 | 260 | - | |
| HY200-2DA | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2DB | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - |
This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.
The core is used for gold finger protection. After the plug-in end (gold finger) of the circuit board is plated with gold/tin, adhesive tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue can be easily peeled off, which is necessary for PCB process. At the same time, it can be used for local shielding protection during wave soldering and reflow soldering of circuit boards.
Adapts to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. It can also fix electronic flat cables and wire harnesses, which is resistant to high temperature and does not release harmful substances, and is suitable for internal wiring of high-end electronic equipment.
In the processing of soft-package lithium batteries and cylindrical lithium batteries, it is used for battery lug insulation and battery wrapping and fixing, which can withstand the high-temperature process when battery is packaged, and has the characteristics of electrolyte corrosion resistance to ensure the safety and stability of batteries.
When spraying, baking and sandblasting electronic components, it is used to shield and protect the parts that do not need to be treated. It can withstand high temperature, and there is no residual glue and no damage to the substrate after shielding.
Meet the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapt to the manufacture of high-end new energy products.
Used for shielding protection when photovoltaic cells are welded in series, and it is resistant to high-temperature welding process, ultraviolet rays and high-low temperature cycles, so as to meet the long-term use requirements of outdoor photovoltaic modules. It can also be used for insulation and sealing assistance of assembly frame and junction box.
Used in on-board motors and electronic control systems for line insulation and high-performance components.
Inside the power battery pack, it is used for insulation and isolation between batteries and modules, and can withstand the high and low temperature and vibration environment when the car is driving.
Used for shielding and insulation in high-temperature process when the core components of fuel cell are processed, which can withstand the corrosion of hydrogen environment and ensure the stability of the equipment.
Suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.
When metal parts are sprayed, electrophoresed and electroplated at high temperature, they are used for shielding and protecting the non-processed surfaces, which can withstand high temperature and do not react with metal substrates. It can also be used for surface protection of metal stamping and bending to prevent scratching.
When high-temperature resistant plastics and carbon fiber composite materials are molded, they are used for mold shielding and product positioning, and can withstand high molding temperature. There is no residual glue after peeling to ensure the surface smoothness of products.
Used to cover the parts that don't need curing in the high-temperature baking and curing process of various products (such as hardware, plastics and coatings), and can withstand the high temperature and adapt to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes, which can withstand high packaging temperature and has high cleanliness without dust pollution.
Used in high-end medical instruments (such as high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components, which can withstand high-temperature sterilization process and meet medical-grade environmental protection standards.
Some polyimide tapes can be used as high-temperature resistant label substrate for labels that need to be kept in high-temperature environment for a long time (such as engine and boiler parts).
Wide temperature range, excellent insulation, acid and alkali resistance / salt fog / ultraviolet resistance, peeling without residual glue, which can benchmark international similar high-end products.
Products with different thickness, viscosity and temperature resistance can be customized according to the needs of different industries to adapt to different processes and scenarios, and at the same time, they have cost advantages and cost performance ratio is higher than that of international brands.
Polyimide tape is a high-performance adhesive tape made from a polyimide film base coated with a heat-resistant silicone adhesive. It is commonly called "Golden Finger Tape" because one of its primary applications is protecting the gold-plated connector fingers (gold fingers) on PCBs during soldering and electroplating processes. Its golden-amber color also contributes to the popular nickname.
All models in the HY200 series are rated for continuous temperature resistance up to 260°C. This makes them suitable for demanding high-temperature processes such as wave soldering, reflow soldering, high-temperature baking, and industrial curing operations without deforming or leaving adhesive residue.
No. One of the key advantages of high-quality polyimide tape is that it peels off cleanly without leaving any adhesive residue on the substrate, even after exposure to high temperatures. This is critical in PCB manufacturing, semiconductor processing, and industrial coating applications where surface cleanliness is essential.
Several HY200 series models offer direct equivalents to well-known 3M products: HY200-2B is equivalent to 3M98C-12, HY200-2D is equivalent to 3M7413D, and HY200-2F is equivalent to 3M98C-1. These models provide comparable performance at a more competitive cost.
Yes. Products with different thickness, adhesion strength, viscosity and temperature resistance levels can be customized to meet the specific demands of different industries and manufacturing processes. This flexibility allows the tape to be tailored for applications ranging from delicate semiconductor packaging to heavy-duty industrial metal processing, while maintaining a cost advantage over international brands.
Absolutely. Polyimide tape is widely used in new energy applications including photovoltaic (solar) modules, new energy vehicle on-board electronics, power battery pack insulation, and hydrogen fuel cell component processing. Its combination of high-temperature resistance, electrolyte corrosion resistance, UV resistance, and excellent electrical insulation makes it an ideal solution for the demanding requirements of the new energy sector.
