| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | - |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | - | |
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | - | |
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2D | 0.025 | 0.060 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | - | |
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.050 | 0.080 | 6.0 | 20 | 55-65 | 260 | - | |
| HY200-3B | 0.050 | 0.100 | 6.5 | 20 | 55-65 | 260 | - | |
| HY200-4 | 0.075 | 0.120 | 6.0 | 28 | 60-65 | 260 | - | |
| HY200-5 | 0.100 | 0.150 | 6.0 | 36 | 70-75 | 260 | - | |
| HY200-6 | 0.125 | 0.180 | 6.0 | 40 | 80-85 | 260 | - | |
| HY200-2DA | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2DB | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - |
Polyimide tape (commonly known as Golden Finger Tape) is a premier category of specialty adhesive solutions engineered for high-performance manufacturing environments. Characterized by outstanding thermal stability, superior electrical insulation, and chemical resistance to acids and alkalis, it fulfills the most rigorous industrial demands. Its applications span across multiple high-tech sectors including electronics and new energy sectors:
Serving as the primary sector for polyimide tape utilization, it adapts seamlessly to precision electronics manufacturing and the stringent handling requirements of microelectronic components.
Primarily engineered for gold finger shielding. During wave soldering and electroplating, the tape isolates plug-in contacts to eliminate contamination and corrosion. Peels off cleanly without adhesive residues post-soldering.
Provides critical lead insulation and joint shielding for resistors, capacitors, inductors, and IC chips to avoid short circuits. Delivers safe internal cable bundle anchoring without releasing toxic outgassing under elevated temperatures.
Ideal for soft-pack and cylindrical cells, facilitating electrode tab insulation, cell bundling, and secure fixation. Resists high-temperature sealing pressures and harsh electrolyte corrosion to maintain battery integrity.
Delivers robust surface masking during spraying, baking, and sandblasting operations. It reliably safeguards critical non-treatment zones without leaving adhesive marks or causing surface degradation.
Fulfills the stringent thermal endurance, weatherability, and insulation demands intrinsic to clean energy engineering and high-end automotive applications.
Offers critical shielding during solar cell series soldering. Effectively withstands high-temperature cycles, intense UV degradation, and outdoor weathering while assisting in assembly frame junction box insulation.
Employed throughout drive motors and electronic control assemblies, serving as dependable high-voltage line insulation and thermal protection for mission-critical components.
Secures reliable partition and insulation between internal battery cells and structural frames, withstanding continuous mechanical vibration and cyclic temperature shifts.
Facilitates surface protection and high-grade insulation during the thermal processing of fuel cell components, offering resilience against harsh hydrogen corrosion.
Universally adaptable across industrial heat-treatment operations, offering distinct mechanical endurance and custom capabilities.
Ensures immaculate masking during powder coating, electrophoresis, and electroplating. It resists high-heat reactions with metal alloys and guards against stamping abrasion.
Applied for mold release shielding and structural positioning during carbon fiber and engineering plastic curing cycles, ensuring flawless surface finishes upon clean removal.
Protects selected areas across hardware, engineering polymers, and custom coatings during industrial baking and heat-curing workflows.
Used for wafer surface shielding and pin insulation during precision cutting and packaging, offering cleanroom-grade standards without particulate contamination.
Insulates and anchors electronic elements within sterilization apparatus and precision diagnostic equipment, compliant with strict healthcare environmental standards.
Functions as a durable base substrate for tracking barcode labels intended for prolonged thermal exposure, such as aerospace systems, engines, and industrial boilers.
Characterized by broad temperature stability, dielectric strength, salt-spray barrier, and non-residue peel-off that directly matches global Tier-1 brands.
Available in custom widths, thicknesses, adhesion levels, and precision die-cut shapes, providing an economical alternative to traditional branded tapes without performance loss.
