Engineered to operate seamlessly from -269°C cryogenic limits up to continuous 260°C (400°C peak thermal spikes). Browse verified factory-direct formulations optimized for global electronics OEMs.
Polyimide (PI) film represents the apex of organic dielectric films. Through precise polycondensation of pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) in polar solvents such as N-methyl-2-pyrrolidone (NMP), followed by bidirectional biaxial stretching and thermal imidization at temperatures exceeding 380°C, our factory crafts aromatic backbone chains capable of surviving conditions where conventional PET, PEN, and PTFE substrates undergo chemical rupture.
The planar, conjugated heterocyclic imide ring provides exceptional intermolecular forces and rigidity. This chemical layout prevents thermal softening and melting up to 400°C, offering reliable dimensional stability without creep under extreme mechanical and thermal shear stresses.
Engineered for high-frequency electrical isolation, our wholesale Kapton alternative film provides a volume resistivity above 1016 Ω·cm and a high breakdown threshold exceeding 200 kV/mm, ensuring zero electrical leakage in high-density power electronics.
Bonded with cross-linked organopolysiloxane pressure-sensitive adhesives (PSA) cured in continuous cleanroom tunnels. Delivers strong adhesion to treated metals, glass, and copper while detaching cleanly without volatile residue or silicone shadow.
Examine ASTM, IPC-TM-650, and IEC 60394 standardized test metrics across commercial thicknesses. Compare our factory-grade HN equivalent against industry benchmarks for engineering verification.
| Property / Test Item | Standard Test Method | Grade HY-PI-12.5 (0.5 mil) | Grade HY-PI-25 (1.0 mil) | Grade HY-PI-50 (2.0 mil) | Grade HY-PI-125 (5.0 mil) |
|---|---|---|---|---|---|
| Nominal Thickness | Micrometer ASTM D374 | 12.5 ± 1.0 μm | 25.0 ± 1.5 μm | 50.0 ± 2.5 μm | 125.0 ± 4.0 μm |
| Tensile Strength (MD/TD) | ASTM D882 | ≥ 195 / 185 MPa | ≥ 215 / 205 MPa | ≥ 220 / 210 MPa | ≥ 210 / 195 MPa |
| Elongation at Break | ASTM D882 | ≥ 55% | ≥ 65% | ≥ 75% | ≥ 80% |
| Dielectric Strength (AC) | ASTM D149 (60Hz) | ≥ 5.5 kV | ≥ 7.2 kV | ≥ 11.5 kV | ≥ 19.5 kV |
| Dielectric Constant (1 MHz) | ASTM D150 | 3.2 - 3.4 | 3.3 - 3.4 | 3.4 - 3.5 | 3.4 - 3.5 |
| Thermal Conductivity | ASTM C518 | 0.14 W/m·K | 0.16 W/m·K | 0.17 W/m·K | 0.19 W/m·K |
| Flammability Classification | UL 94 | V-0 | V-0 | V-0 | V-0 |
| Standard Roll Width / Length | Factory Standard | 500mm – 1040mm × 1000m | 500mm – 1040mm × 1000m | 500mm – 1040mm × 500m | 500mm – 1040mm × 250m |
Across cleanroom micro-fabrication, aerospace exploration, automotive electrification, and high-frequency communication, Kapton-type polyimide film provides dependable thermal stability and physical protection.
Modern 800V silicon carbide (SiC) EV battery architecture demands high-voltage puncture resistance and thin insulation. Our polyimide tapes serve as dielectric wraps for cylindrical, prismatic, and pouch cell tabs. They withstand electrolyte swelling (DMC/EMC/EC solvents) and deliver class-leading flame resistance to prevent runaway cell propagation.
Kapton tape and fluoropolymer-laminated PI films (FN-type) form lightweight insulation blankets and harness wrappers for civilian aircraft and satellite solar arrays. Maintaining ductility down to liquid helium temperatures (-269°C) without embrittlement, it withstands atomic oxygen bombardment and space vacuum outgassing (CVCM < 0.1%).
During wave soldering, reflow ovens, and molten solder baths operating at 260°C-280°C, polyimide tapes protect edge-connectors and micro-vias. Our specialized polysiloxane adhesives form a tight seal that prevents solder bridging and leaves behind zero adhesive residue upon automated high-speed peeling.
Precision-cast ultra-flat polyimide film carriers ensure stable die bonding during backend microchip packaging. High thermal conductivity filled polyimides dissipate local heat spikes during lead-frame encapsulation, while anti-static treated PI films protect sensitive MOSFET and GaN gates from ESD damage.
Huayuan Electronics operates dust-free synthesis and precision coating workshops certified under ISO 9001:2015. Every master roll undergoes rigorous in-line inspections to ensure compliance with global high-reliability standards.
Equipped with closed-loop micro-gravure and comma reverse coating heads within positive-pressure Class 1,000 cleanrooms. This setup prevents pinholes, airborne lint, or micro-voids in both adhesive layers and base films, delivering high optical purity and consistent breakdown resistance.
Online radiometric beta-gauging monitors adhesive and substrate profiles at 120 scans per minute. Multi-zone automated servo tension control eliminates core telescoping, stretch deformation, and wrinkling during slitting from master log rolls down to 2mm widths.
Our in-house analytical lab validates batches via FTIR spectroscopy, thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), peel adhesion load cells, and high-voltage dielectric breakdown units. Certificates of Analysis (COA) accompany every export shipment.
As computing density rises and high-power electronics shrink, functional polymer substrates face higher demands. Huayuan's polymer synthesis R&D lab is driving breakthroughs across four strategic fronts.
Doping high-purity functional boron nitride (h-BN) and sub-micron alumina into the PMDA matrix boosts thermal conductivity by up to 10x without compromising breakdown voltage.
Replacing aromatic dianhydrides with cycloaliphatic monomers yields optical-grade films with >90% transmittance and haze <1.0%, serving foldable OLED covers and optical sensors.
Incorporating micro-porous fluorinated structures reduces dielectric constant (Dk < 2.6) and loss tangent (Df < 0.001) at 28-77 GHz, helping curb millimeter-wave attenuation in 5G/6G antennas.
Developing bio-derived furan and lignin precursor chains cuts polymer lifecycle carbon footprints by 35% while preserving Class H thermal stability for forward-looking tier-1 OEMs.
In-depth technical answers addressing common questions from material engineers, quality inspectors, and procurement teams sourcing Kapton-equivalent polyimide films.
Both materials share the same core polyimide chemistry: aromatic diamines (ODA) reacted with aromatic dianhydrides (PMDA). Our HY-PI grade matches DuPont HN in glass transition behavior, dielectric constant (~3.4), and tensile strength (~200 MPa), providing a drop-in alternative for electronics and aerospace uses at competitive wholesale factory pricing.
Polyimide tape provides continuous thermal stability up to 260°C (400°C peak), whereas PET (Mylar) tape maxes out at 130°C-150°C. While glass cloth tape offers high mechanical tensile strength for heavy-duty motor windings, it is significantly thicker (130-180μm). Polyimide tape achieves equivalent or higher dielectric insulation in a thin profile of only 25μm-50μm, making it ideal for compact electronic assemblies.
We supply two standard adhesive systems: Organo-Silicone adhesive (continuous rating from -40°C to +260°C with clean removal and high chemical resistance) and High-Tack Cross-Linked Acrylic adhesive (suitable up to 155°C, offering higher initial tack and complete silicone-free assurance for optics and paint-shop applications where silicone contamination must be avoided).
Yes. Equipped with cleanroom rotary die-cutting machines, laser plotters, and precision slitters, we supply custom slit tape rolls from 2mm up to 1040mm width. We also offer double-sided corona treatments to boost ink/potting adhesion, along with custom-shaped die-cuts supplied on clear fluoropolymer release liners.
Our manufacturing sites operate under ISO 9001:2015 quality management systems. Our polyimide tapes hold UL 94 V-0 flame-retardant recognition (UL File certified), pass full SGS third-party testing, and comply fully with EU RoHS 2.0 (2011/65/EU) and REACH SVHC regulations, with halogen-free formulations available on request.
Uncoated base polyimide film has an indefinite shelf life under dry conditions due to its high chemical stability. Polyimide pressure-sensitive tapes with silicone or acrylic adhesives carry a certified 24-month shelf life when stored in original packaging at 20°C-25°C and 50% relative humidity, protected from direct sunlight.
Explore our complete production line of industrial double-sided, high-tack VHB, reinforced glass fiber, and heat-resistant sublimation tapes manufactured in our Pearl River Delta factories.
Test our Kapton-equivalent polyimide films directly on your automated assembly line. Connect with our engineering specialists in Zhuhai and Hong Kong for application consultations, customized slitting drawings, and 24-hour turnaround samples.
