| Product Name | Model No | Carrier | Thickness (mm) | Heat Resistance (β) | Tensile Strength | Equivalent |
|---|---|---|---|---|---|---|
| Fiberglass Tape | HY430-1 | Fiber glass | 0.17 | -20 ο½ 80 | 800 | 3M898 |
| HY430-2 | Mesh polyester fiber | 0.20 | 850 | |||
| HY430-3 | Polyester fiber | 0.17 | 750 | |||
| HY430-4 | Double-sided | 0.18 | 850 | |||
| HY430-5 | Non-residual glass fiber | 0.14 | -10 ~ 80 | 850 | ||
| HY430-6 | Residual glass fiber | 0.15 | -5 ~ 70 | 850 |
Glass fiber adhesive tape is soft, easy to stretch and good to fit, which is very suitable for bundling, branch fixing and temporary fixing of wire harness.
Due to the light and thin material, fiberglass tape is suitable for insulation scenes sensitive to thickness, such as:
In the manufacture of lithium batteries, glass fiber tape is often used for:
Its thin and light characteristics will not increase the extra thickness of the battery cell, and it is suitable for designs with high space requirements.
Glass fiber tape can be used in SMT and PCB processes:
Glass fiber tape is made of high-strength glass fiber cloth as the base carrier, coated with high-temperature resistant silica gel or acrylic adhesive. Different models may use carriers such as plain fiberglass, mesh polyester fiber, or double-sided configurations depending on the application requirement.
Most models of fiberglass tape in the HY430 series can withstand temperatures ranging from -20β to 80β. Specific models such as HY430-5 and HY430-6 have slightly different ranges (-10~80β and -5~70β respectively), so it is important to select the right model for your operating environment.
Yes. Fiberglass tape is widely used in lithium battery manufacturing for surface packing of battery cores, temporary fixation between the core and protective plate, and bundling of internal wire harnesses. Its thin and lightweight nature ensures it does not add unnecessary thickness to battery cell designs.
Absolutely. Fiberglass tape is well-suited for SMT and PCB applications, including temporary fixing of flexible circuit boards (FPC), masking areas that should not be tinned or spray-coated, and providing temporary protection during the manufacturing process.
The tensile strength of the HY430 series ranges from 750 to 850 N/m depending on the model. For example, HY430-1 offers 800 N/m tensile strength (equivalent to 3M898), while HY430-2, HY430-4, HY430-5, and HY430-6 all achieve up to 850 N/m.
Non-residual glass fiber tape (HY430-5) is designed to be removed cleanly without leaving adhesive residue on the surface, making it ideal for temporary protection applications. Residual glass fiber tape (HY430-6) may leave some adhesive trace upon removal, and is typically used in applications where permanent or semi-permanent bonding is acceptable.
