| Product Name | Model No | Carrier | Thickness (mm) | Heat Resistance (℃) | Tensile strength | Equivalent |
| Fiberglass tape | HY430-1 | Fiber glass | 0.17 | -20～80 | 800 | 3M898 |
| HY430-2 | Mesh polyester fiber | 0.20 | 850 | |||
| HY430-3 | Polyester fiber | 0.17 | 750 | |||
| HY430-4 | Double-sided | 0.18 | 850 | |||
| HY430-5 | Non-residual glass fiber | 0.14 | -10~80 | 850 | ||
| HY430-6 | Residual glass fiber | 0.15 | -5~70 | 850 |
Glass fiber adhesive tape is soft, easy to stretch and good to fit, which is very suitable for bundling, branch fixing and temporary fixing of wire harness.
It is often used to arrange and fix the internal wiring harness of household appliances, automotive wiring harness and internal connecting wires of electronic equipment.
Due to the light and thin material, fiberglass tape is suitable for insulation scenes sensitive to thickness, such as:
• Lightweight insulation of small motor coil
• Auxiliary insulation of inductors and transformers
• Insulation winding of electronic components
In the manufacture of lithium batteries, glass fiber tape is often used for:
• Light packing on the surface of battery core
• Temporary fixation between battery core and protective plate
• Bundling and insulation of wire harness inside module
Its thin and light characteristics will not increase the extra thickness of the battery cell, and it is suitable for designs with high space requirements.
Glass fiber tape can be used in SMT and PCB processes:
• Temporary fixing of flexible circuit board (FPC)
• Masking areas that do not need to be tinned or sprayed
• Temporary protection in manufacturing process
Glass fiber tape features high-strength glass fiber backing paired with thermal-resistant adhesives. It delivers significantly higher tensile strength, superior heat resistance, optimal insulation properties, and strong chemical stability.
Model HY430-5 is engineered specifically as a non-residual glass fiber tape, making it ideal for temporary electronic component masking, PCB shielding, and process fixation where residue-free peeling is required.
Yes, with ultra-thin options ranging from 0.14 mm to 0.20 mm, it provides dependable insulation and bundle strength without increasing cell pack dimensions or exceeding tight space limitations.
Operating temperature thresholds range between -20°C and 80°C across standard models, offering dependable performance under varying assembly and operational conditions.
Yes, model HY430-1 provides equivalent specifications to 3M 898, delivering comparable tensile strength (800 N) and thickness (0.17 mm) for industrial bundling applications.
