| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | ||
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | ||
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2D | 0.025 | 0.06 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | ||
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.05 | 0.08 | 6.0 | 20 | 55-65 | 260 | ||
| HY200-3B | 0.05 | 0.10 | 6.5 | 20 | 55-65 | 260 | ||
| HY200-4 | 0.075 | 0.12 | 6 | 28 | 60-65 | 260 | ||
| HY200-5 | 0.10 | 0.15 | 6 | 36 | 70-75 | 260 | ||
| HY200-6 | 0.125 | 0.18 | 6 | 40 | 80-85 | 260 | ||
| HY200-2DA | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2DB | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 |
This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.
Core use for gold finger protection. After the plug-in end is plated with gold/tin, tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue — easily peeled off. Also used for local shielding during wave soldering and reflow soldering.
Adapts to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. Fixes electronic flat cables and wire harnesses — resistant to high temperature, no harmful substances released.
Used for battery lug insulation and battery wrapping/fixing in soft-package and cylindrical lithium battery processing. Withstands high-temperature packaging processes; resistant to electrolyte corrosion to ensure battery safety and stability.
When spraying, baking and sandblasting electronic components, used to shield and protect parts that do not need treatment. Withstands high temperature with no residual glue and no damage to the substrate after shielding.
Meet the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapt to the manufacture of high-end new energy products.
Used for shielding protection when photovoltaic cells are welded in series. Resistant to high-temperature welding, UV rays and high-low temperature cycles for long-term outdoor use. Also used for insulation and sealing of assembly frames and junction boxes.
Used in on-board motors and electronic control systems for line insulation and high-component protection.
Inside power battery packs, used for insulation and isolation between batteries and modules. Withstands high/low temperature and vibration environments during vehicle operation.
Used for shielding and insulation in high-temperature processes when core fuel cell components are processed. Withstands hydrogen environment corrosion to ensure equipment stability.
Suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.
When metal parts are sprayed, electrophoresed and electroplated at high temperature, used for shielding and protecting non-processed surfaces. Withstands high temperature without reacting with metal substrates. Also used for surface protection during metal stamping and bending to prevent scratching.
When high-temperature resistant plastics and carbon fiber composite materials are molded, used for mold shielding and product positioning. Withstands high molding temperatures with no residual glue after peeling to ensure surface smoothness.
Used to cover parts that don't need curing during high-temperature baking and curing processes of hardware, plastics and coatings. Withstands high temperatures and adapts to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes. Withstands high packaging temperatures with high cleanliness and no dust pollution.
Used in high-end medical instruments (e.g., high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components. Withstands high-temperature sterilization and meets medical-grade environmental protection standards.
Some polyimide tapes can be used as high-temperature resistant label substrates for labels that need to be maintained in high-temperature environments for a long time, such as engine and boiler parts.
🎯 Core Characteristics Support: Wide temperature range, excellent insulation, acid & alkali resistance / salt fog / UV resistance, peeling without residual glue — benchmarking international similar high-end products.
🔧 Customized Adaptation: Products with different thickness, viscosity and temperature resistance can be customized according to the needs of different industries to adapt to different processes and scenarios. Cost advantages ensure higher cost performance than international brands.
