| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (℃) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | - |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | - | |
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | - | |
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2D | 0.025 | 0.060 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | - | |
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.050 | 0.080 | 6.0 | 20 | 55-65 | 260 | - | |
| HY200-3B | 0.050 | 0.100 | 6.5 | 20 | 55-65 | 260 | - | |
| HY200-4 | 0.075 | 0.120 | 6.0 | 28 | 60-65 | 260 | - | |
| HY200-5 | 0.100 | 0.150 | 6.0 | 36 | 70-75 | 260 | - | |
| HY200-6 | 0.125 | 0.180 | 6.0 | 40 | 80-85 | 260 | - | |
| HY200-2DA | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - | |
| HY200-2DB | 0.025 | 0.060 | 5.0 | 10-13 | 45 | 260 | - |
This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.
The core use is gold finger protection. After the plug-in end (gold finger) of the circuit board is plated with gold/tin, adhesive tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue can be easily peeled off — necessary for PCB process. Also used for local shielding protection during wave soldering and reflow soldering.
Adapts to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. Can also fix electronic flat cables and wire harnesses — resistant to high temperature, no harmful substances released, suitable for internal wiring of high-end electronic equipment.
In the processing of soft-package and cylindrical lithium batteries, used for battery lug insulation and battery wrapping and fixing. Can withstand the high-temperature process during battery packaging, with electrolyte corrosion resistance to ensure safety and stability.
When spraying, baking and sandblasting electronic components, used to shield and protect the parts that do not need to be treated. Can withstand high temperature — no residual glue and no damage to the substrate after shielding.
Meet the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapt to the manufacture of high-end new energy products.
Used for shielding protection when photovoltaic cells are welded in series. Resistant to high-temperature welding, ultraviolet rays and high-low temperature cycles to meet the long-term use requirements of outdoor photovoltaic modules. Also used for insulation and sealing assistance of assembly frames and junction boxes.
Used in on-board motors and electronic control systems for line insulation and protection of high-value components.
Inside the power battery pack, used for insulation and isolation between batteries and modules. Can withstand the high and low temperature and vibration environment when the car is driving.
Used for shielding and insulation in high-temperature processes when the core components of fuel cells are processed. Can withstand the corrosion of hydrogen environments and ensure the stability of the equipment.
Suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.
When metal parts are sprayed, electrophoresed and electroplated at high temperature, used for shielding and protecting the non-processed surfaces — can withstand high temperature and does not react with metal substrates. Also used for surface protection of metal stamping and bending to prevent scratching.
When high-temperature resistant plastics and carbon fiber composite materials are molded, used for mold shielding and product positioning. Can withstand high molding temperatures — no residual glue after peeling to ensure surface smoothness of products.
Used to cover the parts that don't need curing in the high-temperature baking and curing process of various products (such as hardware, plastics and coatings). Can withstand the high temperature and adapt to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes. Can withstand high packaging temperatures with high cleanliness and no dust pollution.
Used in high-end medical instruments (such as high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components. Can withstand high-temperature sterilization processes and meets medical-grade environmental protection standards.
Some polyimide tapes can be used as high-temperature resistant label substrates for labels that need to be kept in high-temperature environments for a long time (such as engine and boiler parts).
Complement the core adaptation advantages (fitting the properties of special adhesive customization and benchmarking):
Wide temperature range, excellent insulation, acid and alkali resistance / salt fog / ultraviolet resistance, peeling without residual glue — benchmarking international similar high-end products.
Products with different thickness, viscosity and temperature resistance can be customized according to the needs of different industries to adapt to different processes and scenarios. At the same time, they have cost advantages and a cost performance ratio higher than that of international brands.
