| Product Name | Model No | Film Thickness (mm) | Total Thickness (mm) | Adhesion to Steel (N/25mm) | Tensile Strength (kg/25mm) | Elongation at Break (%) | Temperature Resistance (°C) | Equivalent |
|---|---|---|---|---|---|---|---|---|
| Polyimide tape | HY200-1A | 0.015 | 0.030 | 2.8 | 10 | 25-35 | 260 | |
| HY200-1B | 0.015 | 0.035 | 3.5 | 10 | 25-35 | 260 | ||
| HY200-2A | 0.025 | 0.042 | 2.5-3.5 | 10-13 | 45 | 260 | ||
| HY200-2B | 0.025 | 0.050 | 4.0 | 10-13 | 45 | 260 | 3M98C-12 | |
| HY200-2C | 0.025 | 0.055 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2D | 0.025 | 0.06 | 5.5 | 10-13 | 45 | 260 | 3M7413D | |
| HY200-2E | 0.025 | 0.065 | 6.0 | 10-13 | 45 | 260 | ||
| HY200-2F | 0.025 | 0.070 | 6.5 | 10-13 | 45 | 260 | 3M98C-1 | |
| HY200-3A | 0.05 | 0.08 | 6.0 | 20 | 55-65 | 260 | ||
| HY200-3B | 0.05 | 0.10 | 6.5 | 20 | 55-65 | 260 | ||
| HY200-4 | 0.075 | 0.12 | 6 | 28 | 60-65 | 260 | ||
| HY200-5 | 0.10 | 0.15 | 6 | 36 | 70-75 | 260 | ||
| HY200-6 | 0.125 | 0.18 | 6 | 40 | 80-85 | 260 | ||
| HY200-2DA | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 | ||
| HY200-2DB | 0.025 | 0.06 | 5.0 | 10-13 | 45 | 260 |
Polyimide tape (often called Golden Finger Tape) is the core category of special adhesive products, with high temperature resistance, acid and alkali resistance and strong insulation, which is suitable for high-end manufacturing scenes and meets the high requirements of special adhesives. Its uses cover many core fields such as electronics and new energy. The specific categories are as follows:
This is the main use of polyimide tape, which adapts to the strict requirements of precision electronic manufacturing, especially to the processing requirements of high-end electronic components.
The core is used for gold finger protection. After the plug-in end (gold finger) of the circuit board is plated with gold/tin, adhesive tape is applied to prevent corrosion and contamination during welding and electroplating. After welding, no residual glue can be easily peeled off, which is necessary for PCB process. At the same time, it can be used for local shielding protection during wave soldering and reflow soldering of circuit boards.
Adapts to resistors, capacitors, inductors, chips and other components for pin insulation and solder joint shielding to avoid short circuit. It can also fix electronic flat cables and wire harnesses, which is resistant to high temperature and does not release harmful substances, and is suitable for internal wiring of high-end electronic equipment.
In the processing of soft-package lithium batteries and cylindrical lithium batteries, it is used for battery lug insulation and battery wrapping and fixing, which can withstand the high-temperature process when battery is packaged, and has the characteristics of electrolyte corrosion resistance to ensure the safety and stability of batteries.
When spraying, baking and sandblasting electronic components, it is used to shield and protect the parts that do not need to be treated. It can withstand high temperature, and there is no residual glue and no damage to the substrate after shielding.
Meet the high requirements of the new energy industry for temperature resistance, weather resistance and insulation, and adapt to the manufacture of high-end new energy products.
It is used for shielding protection when photovoltaic cells are welded in series, and it is resistant to high-temperature welding process, ultraviolet rays and high-low temperature cycles, so as to meet the long-term use requirements of outdoor photovoltaic modules. It can also be used for insulation and sealing assistance of assembly frame and junction box.
Used in on-board motors and electronic control systems for line insulation and high components.
Inside the power battery pack, it is used for insulation and isolation between batteries and modules, and can withstand the high and low temperature and vibration environment when the car is driving.
It is used for shielding and insulation in high-temperature process when the core components of fuel cell are processed, which can withstand the corrosion of hydrogen environment and ensure the stability of the equipment.
It is suitable for all kinds of industrial high-temperature processes, with strong universality and customization requirements.
When metal parts are sprayed, electrophoresed and electroplated at high temperature, they are used for shielding and protecting the non-processed surfaces, which can withstand high temperature and do not react with metal substrates. It can also be used for surface protection of metal stamping and bending to prevent scratching.
When high-temperature resistant plastics and carbon fiber composite materials are molded, they are used for mold shielding and product positioning, and can withstand high molding temperature. There is no residual glue after peeling to ensure the surface smoothness of products.
It is used to cover the parts that don't need curing in the high-temperature baking and curing process of various products (such as hardware, plastics and coatings), and can withstand the high temperature and adapt to different baking processes.
Used for wafer surface shielding and pin insulation in semiconductor wafer cutting and packaging processes, which can withstand high packaging temperature and has high cleanliness without dust pollution.
Used in high-end medical instruments (such as high-temperature sterilization equipment and precision diagnostic instruments) to insulate and fix internal electronic components, which can withstand high-temperature sterilization process and meet medical-grade environmental protection standards.
Some polyimide tapes can be used as high-temperature resistant label substrate for labels that need to be kept in high-temperature environment for a long time (such as engine and boiler parts).
Core Characteristics Support: Wide temperature range, excellent insulation, acid and alkali resistance / salt fog / ultraviolet resistance, peeling without residual glue, which can benchmark international similar high-end products.
Customized Adaptation: Products with different thickness, viscosity and temperature resistance can be customized according to the needs of different industries to adapt to different processes and scenarios, and at the same time, they have cost advantages and cost performance ratio is higher than that of international brands.
Polyimide tape is a high-performance adhesive tape made from a polyimide film base coated with a heat-resistant silicone adhesive. It is commonly called "Golden Finger Tape" because one of its most widespread uses is protecting the gold-plated connector edge (gold finger) of PCBs during electroplating and soldering processes. Its distinctive amber/golden color also contributes to the nickname.
All models in our polyimide tape series are rated for continuous use up to 260°C. This makes them suitable for demanding high-temperature processes such as wave soldering, reflow soldering, high-temperature baking, and semiconductor packaging without deforming, melting, or leaving adhesive residue.
No. One of the key advantages of our polyimide tape is its clean removal property. After completing the high-temperature process and allowing the substrate to cool, the tape can be peeled off cleanly without leaving any adhesive residue on the surface, ensuring the integrity and cleanliness of the protected component.
Several models in our lineup are direct equivalents to 3M products: HY200-2B is equivalent to 3M 98C-12, HY200-2D is equivalent to 3M 7413D, and HY200-2F is equivalent to 3M 98C-1. These equivalents offer comparable performance at a more competitive price point.
Yes. Polyimide tape is widely used in lithium battery production for battery lug insulation, cell wrapping, and module isolation within battery packs. Its electrolyte corrosion resistance, high temperature tolerance, and reliable insulation performance make it an ideal choice for both soft-package and cylindrical lithium battery manufacturing, as well as EV power battery pack assembly.
Absolutely. We offer full customization of polyimide tape including film thickness (ranging from 0.015mm to 0.125mm), total thickness, adhesion level, roll width, and roll length to suit specific industrial processes. Custom specifications are available for electronics, new energy, semiconductor, medical, and industrial manufacturing applications.
